Production line

At EPR, we make the impossible possible. We have the best professionals in-house, with a lot of knowledge and skills.

Our state-of-the-art SMD production line is built to optimize our performance. We work with state-of-the-art equipment, advanced testing methods and innovative quality systems. We are continuously looking for the most efficient way to deliver high-quality products.

Take a peek into our kitchen below.

  • Loading buffer

    This system is used to load printed circuit boards from storage into the production line.

  • Laser marker

    The laser marker places a QR code on the printed circuit board so that it can be followed through the entire process.

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    Laser marker

    The laser marker provides full-process traceability by adding a unique code to PCBs.

    • Dual laser system which allows marking of both sides of PCB’s in one pass.
    • 10 Watt CO2 laser light source with a laser wavelength of 10.6μm.
    • Code128, Code39, DataMatrix, QR and custom barcode types supported. Minimum marking size of barcodes 2x2mm for 2D barcodes.
    • Marking placement accuracy of ±0,1mm.
    • Bad marking recognition function.
  • Stencil printer

    Our Fuji stencil printer applies solderpaste to the circuit board.

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    Stencil printer

    The stencil printer applies solder paste to the PCBs.

    • Ability to print ultrafine patterns (0201 mm) up to large panels.
    • Side & top clamping present for printing up to the edge of PCBs.
    • Automatic printing pressure adjustment function, real-time controlled pressure on squeegees.
    • Repeated alignment accuracy 12.0 μm @ 6 σ (Cpk ≥ 2), printing accuracy 20.0 μm @ 6 σ (Cpk ≥ 2).
    • Slow printing speed of 1mm/s up to fast printing speed of 200mm/s.
  • Solder Paste Inspection (SPI)

    Checks that enough paste has been applied to the printed circuit board.

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    Solder Paste Inspection (SPI)

    The Solder Paste Inspection machine checks whether sufficient solder paste has been applied in all the right places.

    • Measures solder paste deposition with high precision by means of shadow-free multi-camera, multi-project, multi-pattern configuration with a 360° Moiré 3D engine. White and RGB lighting available for establishing optimal inspection settings.
    • 80 Mpixel CMOS sensor camera system with an image resolution of 15μm for capturing defects.
    • Minimum inspectable paste deposition size of 150 μm x 150 μm and maximum of 20 mm x 20 mm, with a maximum height of 400 μm.
    • Z-Referencing technology for inspection of solder paste without cropping.
    • Warpage compensation of maximum 5 mm by dual Z-axis motion.
    • Real-time process control and defect drilldown options.
    • Closed loop learning in analysis environment combining inspection results of AOI and SPI.
    • Volume repeatability of < 3% @ 3σ on PCB at operating temperature, height repeatability of < 1 μm @ 3σ on Certification target at operating temperature and height accuracy of < 2 μm on Certification target at operating temperature.
  • Pick & Place

    These Fuji machines place up to 54,000 components per hour.

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    Pick & Place

    Our two Fuji Pick&Place machines can place up to 54.000 SMD components per hour.

    • Single X,Y robot all-in-one SMT-placement machine suitable for high-mix, variable volume production.
    • Placement of 0402 mm (01005 size) chips up to 102x102mm components possible, with a maximum component height of 25.4 mm for parts <7.5×7.5 mm and a maximum component height of 11.2 mm for larger components. Per machine, up to placement of 130 different components in a single run for 8 mm tape & reel configuration.
    • Dynamic Exchange of turrets by using a Dynamic Exchange head. With the DynaHead dynamical exchange of turrets the optimum nozzle configuration can be achieved in order to accurately place components in an efficient and effective manner.
    • Placing accuracy for small chips and odd-form parts of ±0.040 mm, Cpk ≥ 1.00 (3σ) in standard mode.
    • Theoretical throughput 27,000 components per hour (Cph) per machine for part size 0402 up to 7.5×7.5 mm, 12,000 Cph for part size 1608 up to 15×15 mm and 5,800 Cph for 1608 up to 102×102 mm.
  • Reflow oven

    At the end of this station all components are soldered.

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    Reflow oven

    The Ersa Reflow oven reliably solders the SMD components through a controlled heated air soldering process.

    • Convection reflow soldering system by circulation of heated air. Efficient multi-jet reflow heating system which allows high reproducibility and process stability. By means of the multi-jet reflow heating system balanced air flows are created for heating up products.
    • 10 reflow zones and 3 cooling zones placed above and beneath the conveyance system leading to excellent controllability of a product’s temperature profile and flexibility of usage.
    • Total process length of 4,84 m, with a 3,74 m long heating section and 1,10 m long cooling section suitable for usage on a wide range of products.
    • Low-mass center support which minimizes heat absorption and shadowing.
    • Due to efficient heat transfer a small machine cross-sectional ΔT can be reached.
    • Optional depending on customer demand

      Vapor Phase

      Low temperature soldering.

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      Vapor Phase

      As an alternative to reflow soldering, vacuum vapor phase soldering can be offered. Our vacuum soldering machine optimally reduces voids in soldering junctions and heats the PCB very precisely. It allows for the highest quality solder joints of the most complex SMT modules.

      • The vapor condensates onto the product until the product reaches the temperature of the vapor. This even energy-distribution on the products induces less stress on the product and better heat dissipation. Heating of the product is independent of the products’ shape or colours.
      • Low voiding capabilities. Multi-vacuum vapor phase process reducing voids during the relevant process stage, be it prior to reflow (solder in X state) or during reflow (solder in liquidus state). Especially suitable for reflowing of BGAs and bottom termination components (BTCs).
      • Vapor phase soldering increases the wetting properties of the solder since the surface tension is reduced by the absence of oxidation. Less oxidation of paste and solder joints due to oxygen exclusion.
      • Lowered peak temperatures and higher controllability of peak temperatures due to application of perfluoropolyether process fluids. Lowered risks of component damage or delamination by overheating and in general lowered stresses on components due to low process temperatures.
  • Buffer

    At this stage of the SMD line, everything is cooled and stored when the following stations are occupied.

  • Automated Optical Inspection (AOI)

    This system checks whether all components are correctly placed and properly soldered.

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    Automated Optical Inspection (AOI)

    Automated Optical Inspection enhances assembly quality by means of automated inspection. 2D and 3D inspection detects component defects, placement errors and solder joint defects.

    • Thorough defect coverage by means of employing the combination of 2D and 3D inspection tests. Component defects, component placement defects and solder joints defects can be easily caught by the system.
    • High-resolution 8 megapixels camera with telecentric lens for high quality inspection results. Inspection resolution (via sub-pixel technology) of 4.75 μm.  Shadowing proofing by combining laser and angular cameras. Accurate inspection for any product geometry by the combination of sub-pixel geometric pattern matching, warpage, distortion compensation and 3D algorithms.
    • LED lighting with multiple lighting levels in order to determine the optimal setting for inspection. Axial and peripheral lighting types are available for shadowing prevention and improvement of inspection.
    • PCB warpage compensation up to 5mm.
    • Real-time process control and defect drilldown options.
    • Closed loop learning in analysis environment combining inspection results of AOI and SPI.
    • Optional depending on customer demand


      Checks solder joints that are not visually observable.

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      Our high end 360° X-Ray Analyzer offers us the possibility to visually check inside PCBs for soldering voids and to inspect ligatures and components. This increases the reliability of your products. It allows us to analyse your electronics, for example to discover where malfunctioning originates. The X-Plane function of this machines lets us create a 3D image which can be inspected layer by layer to pinpoint where the exact problem occurred.

      • 2,500 X geometric magnification and High Quality Real Time Imaging with up to 0.5 µm feature recognition possible.
      • 70° Oblique Views without Loss of Magnification
      • 3D inspection by means of X-Plane software.
      • Automated and manual component fault analysis.
      • Multiple types of inspection methods. Plated through hole (PTH) fill percentage calculation. Area voids percentage calculation and automated defect recognition.
    • Optional depending on customer demand

      Selective Wave

      Technique for soldering through hole components.

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      Selective Wave

      For soldering of through-hole components, we use an Ersa Selective soldering machine. This machine reduces manual labour and accurately solders through-hole components. Using a nitrogen supported nozzle, no oxygen is present during the soldering process, increasing soldering quality.

      • Highly flexible and accurate selective wave soldering system. Two different sized nozzles can be simultaneously employed for the creation of optimal solder joints.
      • Build-in convection preheating for uniform warming-up of boards and accurately controlling of flux activation.
      • Nitrogen supported nozzles for high quality solder joint formation.
      • Dual solder pots system with high precision X,Y,Z-motor functions in order to precisely and accurately form high quality solder joints while minimizing stress on nearby components and elements. Positioning accuracy of the solder modules is ±0,15 mm.
      • High precision spray fluxer for local applying of solder flux and diminishing flux residues on products.
    • Optional depending on customer demand

      Ultrasonic Microsolve cleaning machine

      Automatically cleans PCBs through four-stage ultrasonic cleaning.

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      Ultrasonic Microsolve cleaning machine

      Our Guyson’s Kerry cleaning machine automatically cleans the printed circuit boards, using four-phase ultrasonic cleaning and rinsing, vapor rinsing and free-board drying. It degreases the printed circuit board, removes coarse contamination (dirt and oils), defluxes and removes solder residue, preventing ‘dendritic’ growth. The cleaning machine also cleans under the installed components.